50 Waterman Avenue, North Providence, RI 02911 • 401-943-9900

Copper

 

Specifications: (AMS-2418, ASTM B734, ASTM B689, MIL-C-14550)

 

Copper plating creates an outstanding barrier layer that can cover substrate metals and alloys. Copper plating provides an easy-to-plate, level, and in some cases, smooth substrate, making it even more popular than nickel plating for certain metal finishing applications. Although it can be used independently, copper is typically used as an under plate for deposits such as nickel, tin, tin/lead, gold or silver.

 

Copper plating provides an excellent diffusion barrier which prevents components of the base material from migrating into the subsequent plating layers. Copper plating generates high electrical conductivity, which has made it an excellent and inexpensive choice for high tech products as well as other applications.

 

DFI Electroplating is a global supplier to markets in:

 

• Medical & Surgical

• Energy

• Commercial Electronics

• Transportation

• Defense

• Communications and more

We invite you to explore our business and our products. Please feel free to contact us with any questions or special requests. Call today to schedule a tour of our facilities.

DFI Electroplating  © 2014 All rights reserved.  |  50 Waterman Avenue, North Providence, RI 02911  |  401-943-9900  |  sales@dfi-electroplating